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#PROTEUS 8 SOLDER PASTE HOW TO#

If the angle is increased it can cause “scooping” of the holder paste from the stencil apertures and so less solder paste to be deposited.

Squeeze Angle: The angle of the squeegee is typically set of 60° by the holders they are fixed to.

A typical setting for the squeegee pressure is 500 grams of pressure per 25mm of squeegee blade. Too much pressure can cause “scooping” of the paste from larger apertures, excess wear on the stencil and squeegees, and may cause “bleeding” of the paste between the stencil and PCB. Too little pressure can cause “smearing” of the paste on the stencil, poor deposition, and the incomplete transfer to the PCB.

Squeegee Pressure: During the print cycle, it is important to apply sufficient pressure across the entire length of the squeeze blade to ensure a clean wipe of the stencil.

Typically, a setting of 25mm per second is used but this is variable depending on the size of the apertures within the stencil and the solder paste used.

Squeegee Speed: The speed of travel of the squeeze determines how much time is available for the solder paste to “roll” into the apertures of the stencil and onto the pads of the PCB.

#PROTEUS 8 SOLDER PASTE HOW TO#

How to Guarantee Solder Paste Printing Quality? Here we list the most important factors that contribute to successful solder paste printing. The blades are usually constructed from metal.

By dragging the squeegee blade across the stencil, customized as per IPC-7525A, they apply the pressure necessary to cover the circuit board evenly with the paste. As a turnkey PCB assembler, MAD PCB uses automated solder paste printer and squeegee blade to spread the solder paste onto the circuit board.